The SVTA cleaving system is designed for cleaving wafers into thin strips/bars under ultra-high vacuum (UHV) conditions. This process ensures a mirror edge free from contaminants, a critical requirement in high performance laser diodes. The cleaving system mounts on a single flange of the process chamber for further facet coating.
This tool cleaves wafers into bars 15mm long by 1mm wide, for example; other dimensions are available to fit your requirements. The thin bars are stacked, rotated and placed on a deposition block. The deposition block can then be transferred to a deposition chamber for facet coating of the two cleaved edges or for other deposition processes. The entire process is performed under ultra-high vacuum conditions. SVTA will assist you with pairing this apparatus with an SVTA deposition chamber, or adding the cleaving system to your existing system configuration.
Contact SVTA for more information.
