SVT Associates is a world
leading manufacturer of
Molecular Beam Epitaxy
systems and other Thin
Film Deposition Equipment.
leading manufacturer of
Molecular Beam Epitaxy
systems and other Thin
Film Deposition Equipment.
Cleaving System
The SVTA cleaving system is designed for cleaving wafers into thin strips/bars in a UHV process chamber. The cleaving system mounts on a single flange of the process chamber. The tool cleaves wafers into 15mm long by 1mm wide bars; other dimensions are available to fit your system needs. The thin bars are stacked, rotated and placed on a deposition block. The deposition block can then be transferred to a deposition chamber for facet coating of the two cleaved edges or for other deposition processes. The entire process is performed under ultra-high vacuum conditions. SVTA will assist you to add the cleaving system to your existing system configuration.
Contact SVTA for more information.